FN0143E001A
FANNAL
1.43
36.35*36.35
-20~70
-30~80
466×466
QSPI
750
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Drawing
Specifications
Item | Specification | Unit |
|---|---|---|
Diagonal size | 1.43 | inch |
Resolution | 466×466 | |
Display color | 16.7M (RGB × 24bits) | - |
Pixel arrangement | Real RGB arrangement | - |
Interface | QSPI | - |
Driver IC | CO5300 | - |
Dimension outline | 40.30(V) × 40.60(W) × 2.325(T) | mm |
LTPS Glass outline | 39.23(V) × 39.15(W) | mm |
Encapsulation Glass outline | 39.15(V) × 39.15(W) | mm |
Active area | Φ36.35 | mm |
Pixel pitch | 78 × 78 | μm |
Glass thickness | 0.5 | mm |
Operation Temp | -20~70 | ℃ |
Storage Temp | -30~80 | ℃ |
Luminance | 750 cd/m² (TYP), 700 cd/m² (MIN) | cd/m² |
Environmental Compliance | ROHS & HALOGEN FREE | - |
Item | Symbol | Min. | Typ. | Max. | Unit | Remark |
|---|---|---|---|---|---|---|
AMOLED Power | ELVDD | 3.25 | 3.3 | 3.35 | V | Positive |
AMOLED Power | ELVSS | -3.3 | -3.3 | -3.35 | V | Ref Negative |
Digital Power Supply | VDDIO | 1.7 | 1.8 | 1.95 | V | Ref |
Analog Power Supply | VCI | 3.25 | 3.3 | 3.35 | V | Ref |
Pin No. | Symbol | I/O | Function Description |
|---|---|---|---|
1 | ELVSS1 | Power | AMOLED power Negative |
2 | ELVSS2 | Power | AMOLED power Negative |
3 | ELVDD1 | Power | AMOLED power Positive |
4 | ELVDD2 | Power | AMOLED power Positive |
5 | FOG | - | Test pin |
6 | FOG/FOF | - | Test pin |
7 | FOF | - | Test pin |
8 | VREFP5 | Power | No connection |
9 | VREFN5 | Power | OLED drive voltages |
10 | BVP3D | Power | AMOLED power Positive in idle mode |
11 | BVN3D | Power | AMOLED power Negative in idle mode |
12 | VCL | Power | Driver IC internal power |
13 | VREF | Power | Driver IC internal power |
14 | VCI | Power | Driver IC analog supply |
15 | VCI | Power | Driver IC analog supply |
16 | TE1 | O | Tearing effect output pin |
17 | SWIRE | O | Swire protocol setting pin of Power IC |
18 | TE | O | Tearing effect output pin |
19 | RESX | - | This signal will reset the device and must be applied to properly initialize the chip. Signal is active low. |
20 | SDO | O | Serial output signal in SPI I/F. The data is output on the rising/falling edge of the SCL signal. |
21 | SDI_RDX | I | Serial input signal in SPI I/F. The data is input on the rising edge of the SCL signal. |
22 | DCX | I | Display data / command selection in 80-series MPU I/F and 4-wire SPI I/F. D/CX = "0": Command; D/CX = "1": Display data or Parameter |
23 | WRX_SCL | I | A synchronous clock signal in SPI I/F. |
24 | CSX | I | Chip select input pin ("Low" enable) |
25 | D0 | I/O | 8-bit-directional data bus for 80-series MPU I/F and 8-bit input data bus for RGB I/F |
26 | D1 | I/O | 8-bit-directional data bus for 80-series MPU I/F and 8-bit input data bus for RGB I/F |
27 | IM1 | I | Interface type selection. |
28 | IM0 | I | Interface type selection. |
29 | DSWAP | I | Input pin to select HSSI_D0/D1 data lane sequence in high speed interface only |
30 | PSWAP | I | Input pin to select HSSI_D0/D1 data lane polarity in high speed interface only |
31 | VDDIO | Power | Driver IC digital I/O supply |
32 | VDDIO | Power | Driver IC digital I/O supply |
33 | DVDD | Power | Driver IC analog supply |
34 | DGND | Power | The power ground |
35 | HSSI_D1_P | I/O | These pins are DSI-D1+/- differential data signals |
36 | HSSI_D1_N | I/O | These pins are DSI-D1+/- differential data signals |
37 | AGND1 | Power | The power ground |
38 | HSSI_CLK_P | I | These pins are DSI-CLK+/- differential clock signals |
39 | HSSI_CLK_N | I | These pins are DSI-CLK+/- differential clock signals |
40 | AGND2 | Power | The power ground |
41 | HSSI_D0_P | I/O | These pins are DSI-D0+/- differential data signals |
42 | HSSI_D0_N | I/O | These pins are DSI-D0+/- differential data signals |
43 | AGND3 | Power | The power ground |
44 | C11P | - | Capacitor connection pins for the step-up circuit which generate AVDD |
45 | C11N | - | Capacitor connection pins for the step-up circuit which generate AVDD |
46 | C12P | - | Capacitor connection pins for the step-up circuit which generate AVDD |
47 | C12N | - | Capacitor connection pins for the step-up circuit which generate AVDD |
48 | AVDD | Power | Driver IC internal power |
49 | C31P | - | Capacitor connection pins for the step-up circuit which generate VCL |
50 | C31N | - | Capacitor connection pins for the step-up circuit which generate VCL |
51 | C32P | - | Capacitor connection pins for the step-up circuit which generate VCL |
52 | C32N | - | Capacitor connection pins for the step-up circuit which generate VCL |
53 | C41P | - | Capacitor connection pins for the step-up circuit which generate VGH |
54 | C41N | - | Capacitor connection pins for the step-up circuit which generate VGH |
55 | C51N | - | Capacitor connection pins for the step-up circuit which generate VGL |
56 | C51P | - | Capacitor connection pins for the step-up circuit which generate VGL |
57 | VGH | Power | Driver IC internal power |
58 | VGHR | Power | Driver IC internal power |
59 | Dummy | - | NC |
60 | VGLR | Power | Driver IC internal power |
61 | VGL | Power | Driver IC internal power |
62 | AGND4 | Power | The power ground |
63 | MTP_PWR | Power | Power supply for OTP. Leave the pin to open when not in use. |
64 | FOG | - | Test pin |
65 | FOG/FOF | - | Test pin |
66 | FOF | - | Test pin |
67 | ELVDD3 | Power | AMOLED power Positive |
68 | ELVDD4 | Power | AMOLED power Positive |
69 | ELVSS3 | Power | AMOLED power Negative |
70 | ELVSS4 | Power | AMOLED power Negative |
Pin No. | Symbol | I/O | Function Description |
|---|---|---|---|
1 | FOG1 | - | FOG test pin |
2 | FOG2 | - | FOG test pin |
3 | GND1 | P | The power ground |
4 | GND2 | P | The power ground |
5 | Y07 | - | TP signal |
6 | Y06 | - | TP signal |
7 | GND3 | P | The power ground |
8 | X00 | - | TP signal |
9 | X01 | - | TP signal |
10 | X02 | - | TP signal |
11 | X03 | - | TP signal |
12 | X04 | - | TP signal |
13 | X05 | - | TP signal |
14 | GND4 | P | The power ground |
15 | Y00 | - | TP signal |
16 | Y01 | - | TP signal |
17 | Y02 | - | TP signal |
18 | Y03 | - | TP signal |
19 | Y04 | - | TP signal |
20 | Y05 | - | TP signal |
21 | GND5 | P | The power ground |
22 | X07 | - | TP signal |
23 | X06 | - | TP signal |
24 | GND6 | P | The power ground |
25 | GND7 | P | The power ground |
26 | FOG3 | - | FOG test pin |
27 | FOG4 | - | FOG test pin |
Applications
Designed for compact, high-end wearable devices requiring high resolution, low power consumption and premium visual performance.
Smartwatches
Fitness trackers
Health monitoring devices
With 466×466 resolution and real RGB arrangement, the display delivers sharp UI rendering and smooth graphical performance, suitable for advanced smartwatch interfaces and always-on display modes.
Optimized for wearable devices used in outdoor or high ambient light environments.
Outdoor smartwatches
Sports wearables
Field-use monitoring devices
The 750 nits brightness (typ.) ensures clear visibility even under direct sunlight, addressing a common limitation of standard AMOLED displays in outdoor scenarios.
A suitable solution for space-constrained embedded systems requiring circular UI design.
Handheld instruments
Portable testing devices
Mini control terminals
The QSPI interface enables faster data transmission with reduced pin count, simplifying system integration for embedded platforms.
Supports product designs where circular displays enhance usability or aesthetics.
Smart home controllers
IoT control panels
Industrial wearable terminals
The on-cell touch integration reduces module thickness and improves optical performance, enabling more compact and reliable product design.
Building control panels, elevator displays, security monitoring stations, access control interfaces, energy management terminals
Case Study
A wearable device manufacturer required a compact, high-resolution round display for a next-generation smartwatch focused on outdoor usability and premium UI experience.
Key requirements included:
High pixel density for detailed UI rendering
Sufficient brightness for outdoor visibility
Thin module structure for lightweight design
Simplified integration with embedded mainboard
1. Outdoor Visibility Limitation of AMOLED
Standard AMOLED displays often struggle under strong ambient light.
2. Space Constraints in Compact Wearable Design
Limited internal space required a thinner and highly integrated display solution.
3. Interface Complexity
Traditional interfaces increase pin count and complicate PCB design in small devices.
High-Brightness AMOLED Panel (750 nits)
Improved outdoor readability compared to conventional AMOLED solutions
On-cell Touch Integration
Reduced overall module thickness and simplified assembly
QSPI Interface Implementation
Lower pin count and faster communication for compact embedded systems
466×466 High Resolution with Real RGB
Enhanced UI clarity and visual performance
Improved display visibility in outdoor environments
Reduced module thickness and overall device weight
Simplified system integration and PCB layout
Enhanced user experience with sharper UI rendering
AMOLED Display Customization Capabilities
Unlike TFT LCD modules, AMOLED displays are typically based on fixed panel specifications. Customization focuses on module integration, mechanical design and system compatibility.
Customization Capability Comparison
Category | TFT LCD | AMOLED |
|---|---|---|
Panel Selection | Highly flexible | Limited to available models |
Brightness Design | Fully customizable | Panel-dependent |
Touch Structure | Fully customizable | Mostly integrated (on-cell) |
Optical Stack | Flexible | Semi-fixed |
Interface Options | Wide (RGB, LVDS, eDP) | Limited (MIPI, QSPI) |
Customization Depth | High | Moderate |
Based on available AMOLED panel sizes and resolutions
Stable supply from selected panel partners
Custom FPC design (shape, pin definition)
QSPI / MIPI interface support
Signal optimization for embedded systems
On-cell / integrated touch solutions
Ultra-thin module design
Structural adaptation for wearable devices
Support for compact embedded applications
FAQ
It provides high contrast, deep blacks, and a premium visual experience in a compact circular form. This improves UI readability and aesthetic appeal in wearable devices.
Compared to TFT LCD, AMOLED eliminates the need for a backlight, enabling thinner modules and better power efficiency in dark-mode interfaces. However, engineers should consider burn-in risk and brightness limitations under strong sunlight when designing always-on displays or outdoor wearables.
Yes, it features integrated on-cell touch technology within the display panel. This reduces module thickness and simplifies system integration.
Unlike external touch panels (G+G or G+F+F), on-cell touch limits structural customization but improves optical clarity and reliability. Firmware tuning and cover lens design remain key optimization areas for sensitivity, waterproof performance, and glove touch use cases.
Yes, 750 nits is generally sufficient for outdoor readability in most wearable applications. It balances visibility and power consumption.
While AMOLED displays typically struggle under direct sunlight compared to high-brightness TFT solutions, this level of luminance is optimized for wrist-worn devices. Engineers can further improve visibility through UI contrast design, anti-reflective (AR) coatings, and ambient light sensor-based brightness adjustment.
This display uses a QSPI interface, enabling high-speed communication with reduced pin count. It is well-suited for compact embedded systems.
Compared to RGB or LVDS interfaces in TFT modules, QSPI simplifies PCB routing and reduces connector complexity. However, system designers must ensure compatibility with the host MCU and optimize firmware for efficient frame buffer management and refresh rate performance.
Customization focuses on module integration rather than panel-level changes. Key areas include FPC design, cover lens, and firmware optimization.
Unlike TFT LCDs, AMOLED panels have fixed size and resolution constraints. Engineers can customize mechanical structure, pin definition, optical bonding, and touch sensitivity tuning. This makes AMOLED suitable for application-driven optimization rather than full structural redesign.
Thermal management, power consumption, and lifetime performance are critical factors. These directly affect reliability in compact devices.
AMOLED panels are sensitive to heat and prolonged static content, which may lead to burn-in over time. Proper UI design (pixel shifting, dark mode), power management, and enclosure thermal design are essential. Environmental factors such as operating temperature range and outdoor usage conditions should also be validated early in the design phase.